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Electronic Potting Compound -High Thermal Conductivity -Insulate & Waterproof Circuits, Underwater & Underground -Permanent Hide Proprietary Design, Large Casting, MAX EPC

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Product ID: 149803235

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the epoxy experts, max epoxy systems

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About the item

MAX EPC A/B is a room-temperature cured epoxy-based electronic potting compound designed for large mass potting or encapsulation of printed circuit boards & circuits. MAX EPC A/B is designed to cure slowly for large potting volumes, up to 89 fluid ounces or 2.63 liters. The exothermic heat produced is not enough to produce a "runaway" reaction during cure. MAX EPC is filled with thermally conductive fillers that wick heat away and allow faster cooling. MAX EPC A/B is mixed 4:1 by weight; it provides a 90-minute working time for volumes of 3 cubic inches & up to 45 minutes for larger mass -up to 6 cubic inches without generating high exothermic heat. Its mixed viscosity is 3800 cPs at 25°C, similar to the consistency of or honey. It is poured into place and self-levels in less than 20 minutes. MAX EPC A/B is designed to release air bubbles and cure void-free. Upon cure, MAX EPC is electrically non-conductive and provides a permanent barrier against air, corrosive environments, moisture, and direct physical contact with the circuitry. MAX EPC's high thermal conductivity prevents heat build-up by dissipating heat energy more efficiently. MAX EPC A/B bonds to metals, FRP, ABS, PVC, Plastisol, and other plastic compounds used in wire jacketing and electrical enclosures. MAX EPC is opaque black, offering permanent ing of proprietary circuits & components. MAX EPC is tough and impact-resistant and demonstrates high compressive strength and resistance to s, bases, and most solvents and fuels. MIX RATIO: 4:1 By Weight WORKING TIME: 90 Minutes @ 25°C CURE TIME: 48 Hrs @ 25°C ACCELERATED CURE: 2 Hours @ 100°C HARDNESS: 85 Shore D VOLUME RESISTIVITY: 1 x 10 exp16 Ω/CM DIELECTRIC STRENGTH: 500V/mil THERMAL CONDUCTIVITY:0.72 W/(m•K) SERVICE TEMPERATURE: -20°C to 110°C

Epoxy Potting Compound, Thermally Conductive For Fast Heat Dissipation.
Large Volume, Thick Cross-Section, Low Exothermic Heat Generation.
Lower Viscosity Compared To Other Thermally Conductive Potting Compound.
Insulates AC/DC Current, Suitable For High And Low Voltage Insulating.
Long Working Time - Cures In 24 Hours @ 25°C -Heat Curable For Faster Cure.
Void Filler For Wood, Concrete And Metal.
Dimensionally Stable Casting Resin.
Opaque Black Permanent ing.
Thermally Conductive Epoxy.
Hole Filler.

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